Signal & Power Integrity Simulation

The high data rates and miniature scale of high-speed electronics require high signal and power integrity (SI/PI), with a low risk of interference or noise. As data rates increase, the signal frequency increases and signals propagate more like a high-frequency electromagnetic wave than a classical circuit current, causing signal integrity problems. Understanding the behavior of high-speed electronics goes beyond circuit simulation: it requires a full-wave 3D approach that can model these electromagnetic fields fully to help analyze the design of high-performance printed circuit boards.

Using a Virtual Twin for Virtual SI/PI Tests

The “Virtual Twin” approach can replicate physical tests in the simulation environment, helping signal and power integrity engineers to get their designs right the first time. A Virtual Twin is a high-fidelity model of the system that includes all relevant data in one package. Common SI/PI tests such as IR drop, eye diagram and bathtub plots can be replicated virtually, as can electromagnetic compatibility (EMC) test set-ups such as emissions measurement and bulk current injection (BCI).

Trustworthy Virtual Twins require accurate models. SIMULIA offers access to material databases with the properties of real proprietary substrates, and the ability to create custom materials from measured data using various material property models, such as frequency-dependent materials.

Analyzing Signal Integrity, Power Integrity and EMC

The electromagnetic simulation tools in CST Studio Suite can be integrated into EDA workflows using many industry-standard ECAD and MCAD tools, offering electronic engineers the ability to analyze signal and power integrity problems and EMC concerns at all phases of the design cycle: pre-layout, during layout and post-layout.

Signal Integrity in PCBs, ICs, Cables

Specialized tools provide professional engineers with rule-checkers and solvers needed to analyze integrated circuits (IC) packages, a printed circuit board (PCBs) and cables. General-purpose 3D solvers can simulate the entire board and the device as a whole. The Broadband Macromodeling technology provided by IdEM enables SPICE model extraction from 3D electromagnetic field simulation. Conjugate heat transfer (CHT) simulation can be coupled to the electromagnetic simulation to analyze the thermal performance of electronics and to design cooling systems.