推动半导体创新：从原子到设备
现代世界需要速度更快、功能更强的电子设备，因此它们所依赖的组件也必须以前所未有的快速度发展。半导体的尺寸越来越小、功耗越来越少、带宽越来越高。但是，随着微芯片的物理尺寸越来越接近基本限制，制造难度也与日俱增。
建模与仿真是在设备设计的过程中，使用电子结构仿真来支持这些电子组件的开发，从纳米级半导体到柔性有机薄膜晶体管再到生物传感器，不一而足。 同样重要的是，通过对材料的结构、电子、热和机械属性进行建模，提高集成电路的可靠性。
完整的建模与仿真工具集
BIOVIA Materials Studio 提供完整的建模与仿真工具集，用于探索支撑半导体、晶体管和光伏功能的关键材料属性。
- 半导体制造
- 半导体封装
半导体制造
- 阐明定义电子属性的设备特征
- 确定缺陷对性能的影响
- 氧化物-氧化物界面评估
- ALD、CVD 前驱体评估和设计
- 测定态密度和能带间隙（带偏移）
- 光刻胶分析和气体扩散分析
- 电子传递以生成 IV 曲线，从而帮助设备设计
- 传感功能的光学属性
- 预测显示技术中使用的晶体管材料的发射光谱
- 设计薄膜晶体管，以符合溅射对晶体形态的影响
半导体封装
- 测定树脂固化过程中的介观非均质性，以评估其在固化阶段的热膨胀
- 计算环氧树脂与金属表面的附着力，以解决稳定性、湿度依赖性的问题
- 焊点的结构和电子属性
探索我们的方法
产品开发市场瞬息万变。了解如何利用 BIOVIA 保持领先。
Datasheets
BIOVIA Materials Studio ConformersDatasheets
BIOVIA Materials Studio BlendsDatasheets
BIOVIA Materials Studio Amorphous CellDatasheets
BIOVIA Materials Studio Forcite PlusDatasheets
BIOVIA Materials Studio DMoL3Datasheets
BIOVIA Materials Studio DFTB+Datasheets
BIOVIA Materials Studio ForciteDatasheets
BIOVIA Materials Studio COMPASSDatasheets
BIOVIA Materials Studio FlexTSDatasheets
BIOVIA Materials Studio NMR CASTEPDatasheets
BIOVIA Materials Studio VAMPDatasheets
BIOVIA Materials Studio PhaseFieldDatasheets
BIOVIA Materials Studio Synthia请进入 BIOVIA Materials Studio 用户社区，参加精彩的讨论！
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